Dr. Mohammad Rafiee (PhD, PEng, SMIEEE) is an Adjunct Professor in the Department of Mechanical Engineering at the University of Ottawa, focused on advanced semiconductor and microelectronics packaging. His expertise spans advanced package architectures and qualification—flip-chip, 2D/2.xD/3D, fan-out WLP, and heterogeneous integration.
His work integrates multi-physics FEA and AI/ML to accelerate package co-design and reduce thermal-mechanical-electrical-optical risk. He applies industry standard tools for thermal, structural, signal integrity/EM assessment, optical coupling and machine learning coupled with multi-objective optimization to co-optimize thermal performance, warpage/stress, solder-joint reliability, Signal integrity metrics, and optical coupling efficiency.
Dr. Rafiee also brings strong fabrication, experimental, and reliability depth. His experience includes flipchip and solder-joint reliability prototyping and testing, plus failure analysis and metrology using tools such as C-SAM, SEM, X-ray, and warpage measurement (Shadow Moiré, 3D DIC). He has contributed to OSAT process optimization (SMT/mass reflow, underfill, die attach, etc) and has hands-on R&D experience designing and 3D-printing electronic packages, developing functional pastes, and executing mechanical/thermal/electrical testing and DOE-driven studies.
He has been recognized among the World’s Top 2% Scientists since 2020 (Stanford University–led study) and has served as an Associate Editor and Guest Editor for peer-reviewed journals.