Solder Reflow Station – SRO-700


The solder reflow station is ideal for R&D, process development, and low-to-high volume production.

It includes fast heated plate ramping and a rapid, single-wafer processing capability of > 20°C/second.

Some applications include:

  • Die attachment
  • High vacuum encapsulation
  • MEMS package sealing, IR sensor/crystal package sealing
  • Wafer level packaging
  • Low moisture package sealing
  • High power LED
  • Laser bar
  • Wafer bump/solder ball reflow
  • Diffusion bonding
  • CPV
  • Thermo compression bonding
Image of a solder reflow station on a lab bench