Solder Reflow Station – SRO-700
Description
The solder reflow station is ideal for R&D, process development, and low-to-high volume production.
It includes fast heated plate ramping and a rapid, single-wafer processing capability of > 20°C/second.
Some applications include:
- Die attachment
- IGBT/DBC
- High vacuum encapsulation
- MEMS package sealing, IR sensor/crystal package sealing
- Wafer level packaging
- Low moisture package sealing
- High power LED
- Laser bar
- Wafer bump/solder ball reflow
- Diffusion bonding
- CPV
- Thermo compression bonding
