The system allows for:

  • In-situ alignment (including IR alignment) within 1-micron accuracy of samples in the same chamber as bonding is performed.
  • Inspection of the alignment fiducials when samples are heated to confirm alignment immediately prior to bonding to eliminate inaccuracies due to thermal expansion and mismatch between wafers, machine parts, and platens.  The system also allows the user to perform in-situ chemistry on the wafer surfaces in the bonding chamber.
  • Independent heating of top and bottom wafers up to 500 °C.

Wafer Bonder AML-AWB capabilities: 

  • Anodic, polymer/adhesive, eutectic, thermocompression, glass frit, direct and solder bonding.

Download the Wafer Bonder AML-AWB Brochure (PDF version, 399 KB)

Image of a wafer bonder